Printed Circuit Board

Surface Mount Technology (SMT) - a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). SMT allows for easier use of both sides of the PCB. It is faster and easier to automate than through-hole assembly. Through-Hole Assembly - a method that uses a pre-drilled hole in the board through which a component can be inserted and soldered into place, typically used for larger components or those that are incompatible with SMT. Hybrid/Mixed Technology - applications that come into play when combining both SMT and through-hole assembly techniques to develop the printed circuit board assembly (PCBA). Screen Printing - silk screening a layer of ink trace used to identify the PCB components, marks, logos, symbols, and so on. Solder Paste Inspection (SPI) - a process that closely inspects solder paste deposition before placing a part. This ensures part placement is both accurate and consistent. Reflow Soldering - the most widely used method of attaching surface mount components to PCBs. The reflow process forms acceptable solder joints by first preheating the components/PCB/solder paste and then melting the solder without overheating.

Automated Optical Inspection (AOI) - an automated visual inspection methodology used to test for defects in PCBAs. AOI uses cameras to detect possibly catastrophic failures, such as missing components, as well as basic quality failures, like skewed components. Ball-Grid Arrays (BGA) - a type of surface mount packaging used for integrated circuits (IC). A ball-grid array can provide more interconnection pins than can be put on a dual in-line or flat package. Soldering of BGA devices on PCBs requires precise control and is usually done by automated processes. X-Ray Inspection - a PCB inspection technology that can find hidden features within a target object, such as a BGA containing integrated circuit components that AOI cannot detect. Automation - gives PCBA manufacturers the ability to sort and disperse parts, place components, apply sealants, perform testing, and even package the assembled products. The more automation that can be used, the faster the assembly can be done, which can lead to reduced costs. Point-to-Point Wiring - a more labor-intensive manual assembly process that involves hand-mounting and soldering all components on a circuit board, which often comes into play with a legacy board. PCB Repair - retrofitting or updating existing components can be much more cost effective in comparison to producing new products.